文摘

增强池沸腾传热的芯片使用铝蚀刻过程

作者(年代):h是饶和g . Kalyani

池沸腾过程中受热面是淹没在大量的液体停滞不前。之间的相对运动产生的蒸汽和周围附近的液体加热表面主要是由于蒸汽的浮力效应。随着时间的推移,在沸腾由于电影的形成在受热面传热降低。因此,增强传热的微表面是必需的。这是通过表面改性和加工技术。实现这些表面的制造技术,技术上分为加工、蚀刻、涂料、化学过程和微系统描述。的,这些方法在这个工作传热增强通过增加流动蒸汽泡沫表面上的时刻。这可以通过使用蚀刻技术表面积增加。在腐蚀过程中一定比例的酸混合使用,这样的表面凹凸不平。因此不可能形成不稳定的膜表面。 The objective of this work is to evaluate the pool boiling performance structured surface features on an aluminum chip. The performance is compared with the normal chip before etching. It has wide range of electronic cooling applications because if it’s high potential for removing large amounts of heat resulting from the latent heat of evaporation. It is observed that after etching the heat transfer is enhanced by 15.96%. It is also observed that pure aluminum did not enhances the heat transfer even by etching, but the aluminum alloy enhances the heat transfer after etching.